Topologic TopoLogic Showcases Heat Flux Sensors for IoT Devices and Wearables at Japan Mobility Show 2024 Mainichi Newspaper 2024.08.29
Topologic Nobel Prize-Winning ‘Topological Materials’ Move Toward Social Implementation: University of Tokyo Venture Targets Trillion-Dollar Semiconductor Market in the AI Era BUSINESS INSIDER 2024.06.04
Topologic TopoLogic Selected for NEDO Leading Research Program to Solve Global Computing Challenges @nifty News 2024.05.28
Topologic 2024 GAP Grant Winner Interview with TopoLogic from FutureX Acceleration Program mirai cross 2024.04.09
Topologic TopoLogic Wins at World’s Largest Deep Tech Event (Global Challenge 2024) PR TIMES 2024.03.28
Topologic Tokyo University Spin-out – Topologic: Raises JPY 70 M for High-Performance Memory Development Nikkei Newspaper 2024.02.29
Topologic CEATEC AWARD 2023 – Heat flow sensor that detects heat movement in 0.01 seconds and can be mass-produced at low cost EE Times Japan 2023.10.23
Topologic Topolgic brings the new material next to semiconductor, topological material, to the industry INDUSTRY CO-CREATION 2023.04.10
Topologic Perpendicular full switching of chiral antiferromagnetic order by current: Prof. nakatsuji, Topologic CSO, et. al. nature 2022.07.20
Topologic Topologic, Tokyo Univ.’s quantum science research spinout, raised 130M-yen PR TIMES 2022.04.07